TechWatch

Huawei’s Da Vinci AI accelerator explained at Hot Chips

  Announced at Hot Chips last year and again at the Shanghai Full link Conference, the Da Vinci AI accelerator has been making the rounds. Huawei provided more details at Hot Chips this year. The company said their plan is to scale their technology from inference on wearables to training for the data centers. A big part of the design is the ...

Jon Peddie

  Announced at Hot Chips last year and again at the Shanghai Full link Conference, the Da Vinci AI accelerator has been making the rounds. Huawei provided more details at Hot Chips this year. The company said their plan is to scale their technology from inference on wearables to training for the data centers. A big part of the design is the use of 3D memory. Huawei will use a 3D SRAM cache   Heng Liao, an R&D manager of Huawei, gave a presentation by video. If you've read the news much at all, you know that travel is difficult and legally
...

Enjoy full access with a TechWatch subscription!

TechWatch is the front line of JPR information gathering service, comprising current stories of interest to the graphics industry spanning the core areas of graphics hardware and software, workstations, gaming, and design.

A subscription to TechWatch includes 4 hours of consulting time to be used over the course of the subscription.

Already a subscriber? Login below

This content is restricted

Subscribe to TechWatch