(Source: Samsung) Samsung used the 2021 Hot Chips conference, thirty-third in the series, to further reveal and promote a novel alteration of how high-speed memory could be built with AI technology. Samsung’s revelations included the successful integration of its processing-in-memory (PIM)-enabled High Bandwidth Memory (HBM-PIM) into a commercialized accelerator system. That, said Samsung, would broaden PIM to include DRAM ...
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